BD110 - 1.27mm pitch Header Board to Board Connector

  • BD110 3D Render
    BD110 3D Render

    Product overview

    Active
    Series BD110
    Pitch1.27mm
    GenderHeader
    Number of Contacts02-33
    PCB Mount typeThrough Hole
    Number of RowsSingle
    ElevatedNo
    OrientationRight Angle
    Square Pin Size0.40mm
    Profile2.50mm
    Insulator ColourBlack
    Locating PegWithout

    Product Resources

    • You can find all available models for the selected series below.

      33 contacts

      BD110-33X-X-XXXX-XXXX-XXXX-X-X

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    • Material

      Contact Material: Copper Alloy
      Standard Insulator Material: Polyester LCP, UL94 V-0
      Optional insulator material: Polyamide Nylon 6T, UL94 V-0

      Plating

      (A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
      (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
      (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
      (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”

      Electrical

      Current Rating: 1 AMP
      Contact Resistance: 20mΩ Max.
      Insulation resistance: 1000 MΩ MIN.
      Dielectric withstanding voltage: AC 300 V

      Environmental and Processing

      Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
      LCP Suitable For: IR Reflow, Wave, Manual solder
      Nylon 6T Suitable For: IR Reflow, Wave, Manual solder

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